Price : INR 900/- only

EMI EMC book published in Pune India. This book provides practical aspects of EMC testing and design without resorting to theoretical derivations and formulae. After reading the book, the designer can immediately incorporate measures like filtering, shielding, grounding, cable routing and PCB design at the design stage of the product development cycle. This will save both his money and efforts that would be otherwise be required if he tries to modify a frozen design at the end of the development cycle. This book also has a chapter on CE Marking. For more information, contents and purchase please click under "links" on the right

Author : Chetan Kathalay. (e-mail: chetankathalay@gmail.com).

Following are the contents

CHAPTER 1 : INTRODUCTION TO EMI/EMC.

1.1 WHAT IS EMI/RFI?

1.2 HISTORY OF EMI

1.3 THE PROBLEM OF EMI

1.4 EFFECTS OF EMI

1.5 NEED FOR EMC

1.6 REALISATION OF EMC

1.7 EMC TESTS AND MEASUREMENT

1.8 ELEMENTS OF EMI

1.9 COUPLING MECHANISMS

1.10 EMI VICTIMS

1.11. CONCLUSION

CHAPTER 2. EMC STANDARDS

2.1 INTRODUCTION
2.2 CONTENTS OF EMC STANDARDS
2.2.1 Scope 2.2.2 Definitions:.
2.2.3 EMC Test Environment
2.2.4 Test Set-Up:
2.2.5 Limits, Severity Levels And Performance Requirements :.
2.2.6 Characteristics Of EMC Test Equipment :
2.2.7 Test Method & Results:

2.3 TYPES OF EMC STANDARDS

2.4 CIVILIAN EMC STANDARDS

2.4.1 International Electrotechnical Commission (IEC) (Www.IEC.Ch)

2.4.2 IEC EMC Standards

2.4.3 Type Of IEC Standards

2.4.4 Basic Standards And Tc-77

2.4.5 Overview Of IEC Basic Standards

2.4.6 IEC 61000-3- Series

2.4.7 IEC 61000-4 Series Of Basic Standards

2.4.8 IEC Generic Standards

2.4.9 CISPR Standards

2.4.10 Objectives Of CISPR

2.4.11 Structure Of CISPR

2.4.12 Frequently Referred CISPR Standards

2.4.13 IEC Automotive Standards

2.4.14 Automotive Emission Standards

2.4.15 Automotive Susceptibility/Immunity Standards

2.4.17 European Standards

2.4.18 Cenelec Historical Background

2.4.19 Cenelec Structure

2.4.20 Membership

2.4.21 Other European Standards Organizations

2.4.22 The Making Of An En Standard

2.4.23 European EMC Standards

2.4.24 Federal Communcations Commission (FCC) Standards

2.4.25 FCC Part 15 : Radio Devices

2.4.26 FCC Part 18—Industrial, Scientific, And Medical Equipment

2.4.27 FCC Procedures For Showing Conformance

2.5 MILITARY EMC STANDARDS

2.6 INTRODUCTION TO EMC TESTING

2.6.1. Pre-Compliance And Compliance Testing
2.6.2. Emission Tests

CHAPTER 3 CONDUCTED EMISSION (CE) MEASUREMENT

3.1 INTRODUCTION

3.2 TEST SETUP

3.3 MEASUREMENT INSTRUMENTATION

3.3.1 LISN / A.M.N

3.3.2 LISN Equivalent Circuit.

3.3.3 Y-LISN or Impedance Stabilising Networks (ISNs).

3.3.4 Voltage Probe.

3.3.5 Current Probe

3.4 EMI RECEIVER

3.4.1. Input Impedance.

3.4.2. Intermodulation products.

3.4.3. Selectivity.

3.4.4. Image frequency rejection

3.4.5. Spurious rejection

3.4.6. Pulse response

3.5. RECEIVER STAGES IN DETAIL

3.5.1 I/P Attenuator

3.5.2 Pre-selector and RF amplifier

3.5.3 Mixer

3.5.4 IF Amplifier

3.5.5 Detectors

3.5.6. Peak Detector

3.5.7. Quasi-peak (QP) detector

3.5.8. Average Detector

3.5.9. RMS detector

3.5.10. RMS-average detector

3.5.11 EMI Receiver Vs Spectrum Analyzer.

3.6 UNITS OF MEASUREMENT.

3.7 CONDUCTED EMISSION LIMITS

3.8 LABORATORY TEST SETUP

3.9. EUT CONFIGURATION

3.10. MEASUREMENT PROCEDURE

3.11. DISCONTINUOUS EMISSION OR CLICKS.

3.12 MEASUREMENT OF CLICKS.

3.13 LOW FREQUENCY CONDUCTED EMISSION: HARMONICS

3.13.1 Introduction

3.13.2 Rationale for reducing harmonics

3.13.3 Harmonics Measurement Set-up

3.13.4 Measurement Instrumentation

3.13.5 Requirements Of Source And Meter

3.13.6 Equipment Classification

3.13.7 Limits For Harmonic Current

3.13.8 Test duration

3.13.9. Criterion for compliance

3.14. LOW FREQUENCY CONDUCTED EMISSION: FLICKER

3.15 TEST REPORT

3.16 REFERENCES

CHAPTER 4 RADIATED EMISSION (RE) MEASUREMENT

4.1 INTRODUCTION

4.2 BASIC TEST SETUP
4.3 MEASUREMENT INSTRUMENTATION
4.3.1 EMI Receiver
4.3.2. Antennas
4.3.3. Antenna Factor (AF)
4.4 UNITS OF MEASUREMENT
4.5 FREQUENCY RANGE OF MEASUREMENT
4.6 LIMITS4.7 MEASUREMENT SITE
4.7.1. Open Area Test Site (OATS) 4.7.2 Performance Parameters for OATS – The Site Attenuation (SA)
4.7.3 Practical NSA Measurement
4.7.4 CISPR NSA requirements
4.7.5 Anechoic Chambers
4.7.6 Transverse Electro-Magnetic (TEM) CELLs
4.8. RADIATED EMISSION MEASUREMENT PROCEDURE
4.8.1 Measurement in OATS and Anechoic Chamber
4.8.2 Measurement In GTEM Cell
4.8.3 Validation Procedure for GTEM Cell
4.9 DISTURBANCE POWER MEASUREMENT
4.9.1 Instrumentation 4.9.2 Units Of Measurement
4.9.3 Clamp Transducer Factor
4.9.4 Frequency Range Of Measurement
4.9.5 Limits
4.9.6 Method Of Measurement
4.10 NEAR FIELD EMISSION MEASUREMENT
4.11 TEST REPORTS
4.12 CONCLUSION

CHAPTER 5. CONDUCTED IMMUNITY/SUSCEPTIBILITY TESTING

5.1 INTRODUCTION

5.2 GENERAL TEST SETUP

5.3 ELECTRICAL FAST TRANSIENTS / BURST (EFT/B)

5.3.1 INTRODUCTION

5.3.2. EFT/B PULSE SHAPE

5.3.3. EFT/B TEST GENERATOR

5.3.4. COUPLING/DECOUPLING NETWORK(CDN)

5.3.5. CAPACITIVE COUPLING CLAMP

5.3.6. LABORATORY TEST SETUP

5.3.7. CONDUCTING AN EFT TEST

5.4 SURGE TESTING

5.4.1 INTRODUCTION

5.4.2.TYPES OF SURGES

5.4.3. SURGE WAVEFORMS

5.4.4. SURGE GENERATORS

5.4.5. COUPLING – DECOUPLING NETWORKS (CDN)

5.4.6. LABORATORY TEST SET-UP FOR SURGE

5.4.7. CONDUCTING A SURGE TEST

5.4.8. SELECTION OF SEVERITY LEVELS FOR EFT AND SURGE TESTS.
5.5. CONDUCTED SUSCEPTIBILITY --CONTINUOUS WAVE.
                      5.5.1. INTRODUCTION
        5.5.2. BASIC TEST SET UP.
       5.5.3. TEST GENERATOR REQUIREMENTS
                   5.5.4. COUPLING DECOUPLING N/Ws (CDNs)
       5.5.6. CURRENT CLAMP.
       5.5.5. ELECTROMAGNETIC (EM) CLAMPS
                   5.5.7 LABORATORY SET-UP FOR CONDUCTED RF SUSCEPTIBILITY

5.5.8 TEST SEVERITY LEVELS

5.5.9 CALIBRATING INJECTED LEVEL

5.5.10 PERFORMING A CONDUCTED RF TEST.

5.6 ELECTROSTATIC DISCHARGE TEST

5.6.1 INTRODUCTION

5.6.2. GENERATION OF STATIC CHARGES

       5.6.3. TYPE OF DISCHARGE EVENTS
       5.6.4. EFFECTS OF ESD ON ELECTRONICS
       5.6.5. The Human ESD model

                   5.6.6. ESD SIMULATOR
       5.6.7. Verification of the characteristics of the ESD generator
       5.6.8.Severity Levels
       5.6.9. LABORATORY TEST SETUP 5.6.10. ESD test considerations
       5.6.11. Carrying out an ESD test
       5.6.12. SPECIAL CONDITIONS FOR FLOATING EUTs

5.7. EVALUATION OF TEST RESULTS

5.8. TEST REPORT

5.9. CONCLUSION

CHAPTER 6 : RADIATED SUSCEPTIBILITY/IMMUNITY TESTING

6.1 INTRODUCTION

6.2. GENERAL TEST SET-UP.

6.3. SHILEDED ENCLOSURES

6.4. ANTENNAS

6.5. SIGNAL GENERATORS AND AMPLIFIERS

6.6. MEASURING EQUIPMENT

6.7. ANCILLARY EQUIPMENT

6.8. SEVERITY LEVELS AND FREQUENCY RANGES

6.9. FIELD CALIBRATION.

6.10. TEST PROCEDURE

6.11. ALTERNATE TEST METHOD

6.12. TESTING IN A GTEM CELL
6.13 EVALUATION OF TEST RESULTS AND TEST REPORTS

CHAPTER 7. FILTERING

7.1. INTRODUCTION

7.2. FILTER TYPES

7.3. FILTER IMPEDANCE

7.4. POWER LINE FILTERS

7.5. BASIC ELEMENTS OF FILTERS

7.6 POWER LINE FILTER DESIGN

7.7. OTHER FILTER COMPONENTS

7.8. TRANSIENT SUPPRESSIONS IN RELAYS AND MOTORS

7.9. MULTISTAGE POWER LINE FILTERS

7.10. FERRITE BEADS

7.11. FILTERS FOR DC LINES

7.12. FILTERS FOR DATA CABLES

7.13. FILTERED PIN CONNECTORS

7.14. FILTER INSTALLATION

7.15 FILTER PERFORMANCE EVALUATION

7.16 CONCLUSION.

CHAPTER 8. SHIELDING

8.1. INTRODUCTION

8.2. MECHANISM OF RADIATION

8.3. SHIELDING MECHANISMS

8.4 CHOICE OF SHIELD MATERIAL

8.6. PENETRATIONS AND APERTURES

8.7 LEAKAGES AT SEAMS

8.8. SHIELDS FOR CABLES

8.9. CONCLUSION.

CHAPTER 9. PCB DESIGN FOR EMC

9.1 NEED FOR EMC DESIGN AT PCB LEVEL.

9.2 PRINTED CIRCUIT BOARD (PCB)

9.3 BOARD ZONING

9.3.1. Board zoning according to frequency

9.3.2. Board zoning –disturbed and calm zones

9.4 ASPECTS OF A GOOD PCB DESIGN

9.4.1 Digital ckt layout and noise

9.4.2 Reduction of ground track inductance

9.4.3 Practical high speed ground system

9.4.4. Reduction of loop area

9.4.5. Reservoir/decoupling capacitors

9.4.6. Value of decoupling capactor

9.4.7 Type of decoupling capacitor.

9.5 COMMON IMPEDANCE COUPLING IN PCBs

9.5.1. Eliminating common impedances

9.5.2. Star or multipoint connections

9.6. GENERAL CONSIDERATIONS FOR A PCB

9.6.1.Supply entry

9.6.2 Entry of digital and analog inputs

9.6.3. Bypass capacitors

9.6.4. Supply distribution

9.6.5. Decoupling and bulk decoupling capacitors

9.6.6. Connecting load capacitors of crystal to microcontroller ground.

9.7. MULTILAYER BOARD AND HIGH SPEED PCB DESIGN

9.8 MULTILAYER CONCEPTS

9.8.1. Board Stack-up

9.8.2. Power and ground planes

9.8.4. Reducing cross-talk –The 3W Rule

9.8.5. Guard traces

9.9. POWER AND GROUND PLANES

9.9.1 Functions of a ground plane.

9.9.2. Dimensions of 0V reference plane.

9.10. PLANE RESONANCE

9.11. RESONANCE BETWEEN PLANE PAIRS

9.13. HOLES AND DISCONTINUITIES IN GROUND PLANE.

9.14 ANTIPAD DESIGN

9.15 ROUTING TRACES NEAR ANTIPADS AND SLOTS

9.16. PROBLEMS WITH SPLIT PLANE

9.17. WHEN TRACE CHANGES LAYERS

9.18. CONNECTING DEVICES TO PLANES

9.19. DECOUPLING CAPACITOR PLACEMENT

9.20. USING MULTIPLE DECAPS IN PARALLEL

9.21. DEVICE PLACEMENT

9.22. BOARD STACKING

9.22.1. Board stacking for four layer boards

9.22.3. Board stacking of eight layer PCB

9.22.2 Board stacking of six layer PCB

9.23. MICROVIA / HDI TECHNOLOGy

9.24. SEGREGATION

9.24.1. Segregation using filters

9.24.1.1. SMD filter components

9.24.1.2. RF reference

9.24.1.3. Filter for data lines

9.24.1.4. Filter for unshielded off board connector

9.24.2 Segregation using board level shielding

9.24.2.1 Interconnections to components inside a shielding can

CHAPTER 10. GROUNDING AND BONDING

10.1. INTRODUCTION

10.2. PURPOSE OF GROUNDING

10.2.1. To prevent Shock Hazard

10.2.2. Power Fault Clear-out

10.2.3. Protection against Lightning hazard

10.2.4. Electrostatic Drainage

10.2.5. EMI Control

10.3. STANDARDS REGARDING SAFETY GROUND

10.3.1. International level

10.3.2.Commonwealth level

10.3.3.National level:

10.4. EQUIPMENT AND SYSTEM GROUNDING

10.5. TYPES OF GROUNDING

10.5.1. Single Point Grounding.

10.5.2. Multi point grounding

10.6. REDUCING COMMON GROUND IMPEDANCE COUPLING

10.7. GROUNDING OF CABLE SHIELDS

10.8. GROUNDING OF FARADAY SHIELDED TRANSFORMER

10.9. EARTH PITS

10.9.1 Soil treatment

10.9.2. Earth resistance measurement.

10.9.3. Why lead resistance does not matter

10.9.4. Earth resistance meter.

10.9.5. When surface is covered with concrete and spikes cannot be driven into ground.

10.10 ELECTRICAL BONDING

10.10.1. Effects of improper bonding

10.10.2. Behaviour of a bond at radio frequencies

10.10.3. Types of bonding

10.10.4. Surface treatment

10.10.5. Mitigation of corrosion.

10.10.6. Bonding practices

10.10.7. Bonding of protective earth wire

10.10.8. Bonding of internal protective earth wires

10.10.9. Bonding of mounting plate to the chassis/ electronic cabinet

10.10.10 Bonding screened cables with connectors

10.10.11. Bonding screened cables that have no connectors

10.10.12. Bonding of connector panels

10.10.13. bonding of connectors on connector panel

10.10.14 Bonding of metal cableways.

CHAPTER 11 CABLE SELECTION AND ROUTING

11.11.1 Introduction

11.11.2. Cable Coupling Mechanisms

11.11.3. Running Cables In An Installation

11.11.4.Shape Of Cable Ways

11.11.5. Cable Classes

11.11.6. Type Of Cables For A Particular Class

11.11.7. Cable Segregation

11.11.8. Reducing Common Mode Coupling

11.11.9. Reducing Differential Mode Coupling

11.11.10. Cable Routing In An Electronics Control Panel

CHAPTER 12. CE MARKING
12.1. INTRODUCTION
12.2. THE EUROPEAN UNION BACKGROUND
12.3. EU INSTITUTIONAL STRUCTURE
12.4. TYPE OF LEGISLATIVE ACTIONS
12.5. CE MARKING AND OTHER MARKS
12.6. ESSENTIAL REQUIREMENTS OF CE MARKING
12.7. THE NEW APPROACH TO CONFORMITY
12.8. EU DIRECTIVES12.9. HARMONIZED EUROPEAN STANDARDS
12.10. THE GLOBAL APPROACH TO CONFORMITY
12.11. NOTIFIED BODIES
12.12. THE CE MARKING PROCEDURE